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1

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - High power RF amplifiers module assembly — Issues to consider, design, materials and process

Nguty, Tennyson, Xiao, An, Thoonen, Henk

Year:

2014

Language:

english

File:

PDF, 647 KB

english, 2014

2

The rheological properties of solder and solar pastes and the effect on stencil printing

Tennyson A. Nguty, Ndy N. Ekere

Journal:

Rheologica Acta

Year:

2000

Language:

english

File:

PDF, 156 KB

english, 2000

3

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Development of advanced AuSn alloy plating technology for semiconductor application

Ling, Zhang, Ching, Ng Seow, Zheng, Li, Nong, Fang Shu, Nguty, Tennyson, de Bruin, Emiel, Xiao, An, Thoonen, Henk

Year:

2014

Language:

english

File:

PDF, 1.24 MB

english, 2014

4

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - High power RF amplifiers module assembly — Issues to consider, design, materials and process

Nguty, Tennyson, Xiao, An, Thoonen, Henk

Year:

2014

Language:

english

File:

PDF, 647 KB

english, 2014

5

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Development of advanced AuSn alloy plating technology for semiconductor application

Ling, Zhang, Ching, Ng Seow, Zheng, Li, Nong, Fang Shu, Nguty, Tennyson, de Bruin, Emiel, Xiao, An, Thoonen, Henk

Year:

2014

Language:

english

File:

PDF, 1.24 MB

english, 2014